Features & Benefits
- Solderless device for temporary prototype with electronics
- Ideal for high frequency and low noise circuits
- Special designed spring clip over 5000 insertion cycles
- 830 tie points and 400 tie points options available
- Includes 3PCS 830 Tie-Points Breadboard and 6PCS 400 Tie-Points Breadboard
- Socket Pitch: 2.54mm / 0.1